2024-04-19
The differences between HDI boards (High-Density Interconnect) and regular PCBs (Printed Circuit Boards) include several key points:
Density: HDI boards have higher line and component densities compared to regular PCBs. HDI boards utilize more layers, finer line widths/spacings, and smaller via diameters, achieving higher wiring densities and accommodating more components and traces within limited space.
Via Technology: HDI boards employ advanced via technologies such as microvias, blind vias, and buried vias, enabling more complex interconnections within multilayer boards and improving layout flexibility and reliability of components.
Material Selection: HDI boards typically use high-performance substrate materials such as polyimide (PI) and materials with low dielectric constants to provide better signal transmission performance and higher frequency response, whereas regular PCBs may use conventional FR-4 glass fiber composite materials.
Cost: Due to the need for higher-level manufacturing processes and more expensive materials, the manufacturing cost of HDI boards is usually higher than that of regular PCBs.
Technical Difficulty: Because HDI boards employ complex wiring and via technologies, their manufacturing and design require higher levels of technical expertise and experience.
In summary, HDI boards offer higher line density, more complex interconnection technologies, higher-level materials, and manufacturing processes compared to regular PCBs. They are suitable for applications with high requirements for space, performance, and reliability, such as high-performance computers, communication equipment, and mobile devices.