2023-04-25

The heat generated when electronic equipment is working, therefore, it is very important to dissipate heat on the HDI circuit board. So, what are the factors that affect the heat dissipation of HDI circuit boards? Let's take a look with Zhuhai Shenlian Circuit:

1. Factors that cause the temperature of the HDI circuit board to rise

The direct cause of the increase in the temperature of the printed circuit board is the existence of circuit power dissipation devices, electronic devices all have power consumption to varying degrees, and the heating intensity varies with the power consumption.

Two phenomena of temperature rise in printed circuit boards:

(1) Local temperature rise or large area temperature rise;

(2) Short-term temperature rise or long-term temperature rise.

2. When analyzing the factors affecting the heat dissipation of the HDI circuit board, it is generally analyzed from the following aspects:

1. Electrical power consumption:

(1) Analyze the power consumption per unit area;

(2) Analyze the distribution of power consumption on the HDI circuit board.

2. The structure of the printed circuit board:

(1) The size of the printed board;

(2) The material of the printed board.

3. Installation method of printed circuit board:

(1) Installation method (such as vertical installation, horizontal installation);

(2) The sealing condition and the distance from the casing.

4. Thermal radiation:

(1) The emissivity of the printed board surface;

(2) The temperature difference between the printed board and the adjacent surface and their absolute temperature.

5. Heat conduction:

(1) Install the radiator;

(2) Conduction of other installation structures.

6. Thermal convection:

(1) Natural convection;

(2) Forced cooling convection.

Summary: The analysis of the above factors is an effective way to solve the heat dissipation of HDI circuit boards. Often in a product and system, these factors are interrelated and dependent, and should be analyzed according to the actual situation