2024-04-08
With the continuous development of electronic products, there is a growing demand for High Density Interconnect (HDI) boards. HDI boards feature higher wiring density and smaller component packaging sizes, making them crucial components in modern electronic devices. This article will delve into the detailed manufacturing process of HDI boards to provide readers with a better understanding of the production process and technical aspects involved.
The production of HDI boards begins with design and planning. Circuit design and layout are carried out according to product requirements, determining the number of layers, defining signal and power layers, and planning line widths and spacing.
Inner layer production is the starting point of HDI board manufacturing. Initially, copper foils are laminated onto pre-treated substrates to form the inner layer structure. Subsequently, unwanted copper foils are removed through chemical etching, leaving behind the required circuit patterns.
Copper electroplating is carried out on the inner layer circuit patterns to enhance circuit conductivity and reliability.
Blind vias and buried vias are opened at predetermined locations using laser drilling or mechanical drilling to achieve higher line density and interconnection.
The inner layer structure is bonded with outer copper foil layers to form a complete board structure.
Outer layer circuit patterns are formed on the outer copper foil, similar to the inner layer production process, with unwanted copper foil removed through etching.
Special materials, such as Polyimide (PI), are deposited inside blind vias to increase their mechanical strength and conductivity.
Holes are drilled at the top of blind vias using laser or mechanical drilling, and conductive material (such as copper) is filled to establish electrical connections between inner and outer layers.
Final etching is performed on the outer layer to form the ultimate circuit patterns. Additional processes such as anti-corrosion treatment and surface coating may also be applied.
Completed boards undergo electrical testing and inspection to ensure there are no manufacturing defects or circuit errors.
Finally, components and devices are assembled onto the PCB and connected to the circuit through soldering and other methods, forming the final electronic product.
Through the above process, HDI board manufacturers are able to produce high-quality, high-performance HDI boards to meet the demands of various industries, driving the advancement of modern electronic technology.
This article has provided a detailed overview of the manufacturing process of HDI boards, from design and planning to final assembly and soldering, each step being crucial. With technology continuously advancing, HDI board manufacturing techniques also innovate, providing strong support for the development of electronic products. It is hoped that readers have gained a deeper understanding of the manufacturing process of HDI boards through this article.